Emby / Patterning Materials
Advances in defect performance in metal oxide photoresists for EUV lithography
Analysis of dissolution kinetics of poly(4-hydroxystyrene) with different molecular weight distributions in alkaline aqueous solution using machine learning
Breaking stochastic tradeoffs with a dry deposited and dry developed EUV photoresist system
Chemically-amplified backbone scission (CABS) resist for EUV lithography
Chemistry working for lithography- the Marangoni-effect-based single layer for enhanced planarization
Design considerations for chemically amplified EUV resist materials
Development of high-chi directed self-assembly process based on key learning from PS-b-PMMA system
Development of metal purifiers specific to lithography materials
Development of metal-organic cluster based negative tone resist- pre-screened through the helium-ion beam prelude to extreme ultraviolet lithography (EUVL) applications
Effect of resist film thickness on line-and-space resist patterns on chromium nitride in electron beam lithography
Electron-induced chemistry fundamental to state-of-the-art nanotechnology
Enabling EUV pattern transfer by optimized under layer
EUV defect reduction activities using coater_developer and etching technique
EUV lithographic process enablement with novel litho track hardware
EUV resist performance enhancement by UV flood exposure for high NA EUV lithography
Fundamental study of polymer dynamic behavior in resist processing
High contact angle embedded barrier layer materials for next-generation 193 immersion lithography
High performance filtration for bulk materials- a novel HDPE membrane filter designed for EUV Lithography
Highly fluorinated alternating copolymer possessing high glass transition temperature and cross-linking capabilities under extreme UV radiation
Hybrid resist synthesis by ex-situ vapor-phase infiltration of metal oxides into conventional organic resists
Improved non-CAR type hemicellulose resists for EUV lithography
Modeling the acid-catalyzed cleavage of carbon-oxygen bonds
Multidimensional process optimization of a negative e-beam photoresist for silicon-waveguide manufacturing
Nano-scale effects of selective spin-on deposition
Next generation purification method for achieving low trace metals in ultra-high purity chemicals
Novel functionalized membrane approaches to metal contamination control in advanced lithography filtration
An Outpost of Progress
Preventing method of volume expansion of polymer after metal infiltration
Probing ion diffusion in chemically amplified resists through experiments and atomistic simulations
Progress and challenges of EUV patterning material design
Progress in EUV-Interference Lithography resist screening towards the deployment of high-NA lithography
Reducing the absorbance of a high etch resistant spin-on carbon hardmask
Self-aligned double pattern process using DSA pattern
Sequential infiltration synthesis and pattern transfer using 6 nm half-pitch carbohydrate-based fingerprint block copolymer
Spatial arrangement of block copolymer nanopatterns using photoactive homopolymer substrates
Todayβs scorecard for tomorrowβs photoresist- progress and outlook towards High-NA EUV lithography
Top-coats for scalable nano-manufacturing with high-Ο block copolymers in lithographic applications