Emby / AL2021
0.33 NA EUV systems for high-volume manufacturing
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Advances in defect performance in metal oxide photoresists for EUV lithography
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AL2021
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Analysis of dissolution kinetics of poly(4-hydroxystyrene) with different molecular weight distributions in alkaline aqueous solution using machine learning
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Chemically-amplified backbone scission (CABS) resist for EUV lithography
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Chemistry working for lithography- the Marangoni-effect-based single layer for enhanced planarization
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Design considerations for chemically amplified EUV resist materials
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Development of high-chi directed self-assembly process based on key learning from PS-b-PMMA system
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Development of metal purifiers specific to lithography materials
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Development of metal-organic cluster based negative tone resist- pre-screened through the helium-ion beam prelude to extreme ultraviolet lithography (EUVL) applications
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Effect of high NA β€œhalf-field” printing on overlay error
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Electron-induced chemistry fundamental to state-of-the-art nanotechnology
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Enhancing lithographic performance by new EUV photomask materials
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Etch
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EUV
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EUV dark field lithography- extreme resolution by blocking 0th order
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EUV defect reduction activities using coater_developer and etching technique
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EUV lithographic process enablement with novel litho track hardware
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EUV lithography- past, present and future
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EUV resist performance enhancement by UV flood exposure for high NA EUV lithography
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Fundamental study of polymer dynamic behavior in resist processing
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The future of compute- how the data transformation is reshaping VLSI
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High contact angle embedded barrier layer materials for next-generation 193 immersion lithography
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High performance filtration for bulk materials- a novel HDPE membrane filter designed for EUV Lithography
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High-NA EUV lithography exposure tool- key advantages and program progress
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Highly fluorinated alternating copolymer possessing high glass transition temperature and cross-linking capabilities under extreme UV radiation
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Hybrid resist synthesis by ex-situ vapor-phase infiltration of metal oxides into conventional organic resists
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Imaging enhancement (low k1 imaging) in EUV lithography- current status and future resolution enhancement techniques
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Improved non-CAR type hemicellulose resists for EUV lithography
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Investigation into a prototype EUV attenuated phase-shift mask
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Investigation of waveguide modes in EUV mask absorbers
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Mask is key to unlock full EUVL potential
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Measuring EUV mask
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Micro LED displays- technology and manufacturing challenges
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Multidimensional process optimization of a negative e-beam photoresist for silicon-waveguide manufacturing
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Nano-scale effects of selective spin-on deposition
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Nanophotonics as computing machines
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A new era for AI HPC and IC technologies in the transition to an intelligent digital world
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Next generation purification method for achieving low trace metals in ultra-high purity chemicals
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Novel Patterning
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Optical design of EUV attenuated PSM for contact-hole applications
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Optical Lithography
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An Outpost of Progress
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Patterning Materials
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Post-Moore- prospects for novel patterning of low volume ICs
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Preventing method of volume expansion of polymer after metal infiltration
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Probing ion diffusion in chemically amplified resists through experiments and atomistic simulations
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Progress and challenges of EUV patterning material design
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Progress in EUV-Interference Lithography resist screening towards the deployment of high-NA lithography
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Reducing the absorbance of a high etch resistant spin-on carbon hardmask
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Self-aligned double pattern process using DSA pattern
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Spatial arrangement of block copolymer nanopatterns using photoactive homopolymer substrates
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Statistical analysis of the impact of 2D reticle variability on wafer variability in advanced EUV nodes using large-scale Monte Carlo simulations
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Top-coats for scalable nano-manufacturing with high-Ο‡ block copolymers in lithographic applications
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